← All Project Cases
Electronics Plastic Insert Mold

Metal-Insert Overmolded Housing for Electronics Assembly

Industry: Consumer Electronics
Material: PA66-GF30 / Brass Inserts
Standard: IEC 61000 EMC
Start a Similar Project →
Metal-Insert Overmolded Housing for Electronics Assembly

Challenge · Solution · Result

CHALLENGE

Electronics manufacturer needed a snap-fit housing with 6 brass heat-set inserts per part, critical thread pull-out strength ≥500N, and ±0.05mm dimensional tolerance on all mating features.

OUR SOLUTION

Designed insert-loading fixture and mold cavity for repeatable insert positioning. Used PA66-GF30 compound for dimensional stability. Validated pull-out strength via destructive testing on 50-piece first article.

RESULT

All 6 inserts: pull-out strength 680–720N (target ≥500N). Dimensional CPK ≥1.67 on all critical features. Production yield 99.8% at 10,000 pcs/month.

Engineering Insights

DFM Analysis

DFM Analysis & Process Optimization

DFM Analysis: Gate location optimized to eliminate weld lines near insert positions. Cooling channel configuration reduced cycle time by 22%.

Our engineers work from your CAD drawings before any tooling begins — identifying potential failure modes, proposing material alternatives, and validating gate/cooling layouts digitally. This eliminates costly mold revision cycles.

Empirical Test Data

Physical test results from production samples — available with every shipment on request.

PropertyRequirementResult
Insert Pull-out Strength≥ 500N680–720N
Critical Dimension CPK≥ 1.331.71
Warpage (200mm span)≤ 0.3mm0.18mm
Surface FinishSPI-B1SPI-B1 achieved

Get an Engineering Quote Within 24 Hours

Share your drawings, quantity and material requirements. Our team performs a complimentary DFM review before quoting.

  • 📧 info@bluediamondindustry.comDirect Sales Response
  • 📞 +86 532 86945929Emergency Project Support
  • 💬 +86 1335636048124-Hour WhatsApp Service
  • 🏢 T3Bld NO. 877 Lijiang West Road, Huangdao District, Qingdao, Shandong, China 266555